PRECISION BGA STENCILS RL-044 HW4
1.Pioneering half etching process,let some components fit into the groove Protect components to avoid burns.
2.Suitable for HI6220/6250/MSM8952 CPU,HaweiP8/Huawei P9 youth version/double4G, Honor 4X/4C/5C/5A etc.
Especificaciones
Nombre del producto: PRECISION BGA STENCILS RL-044 HW4
Marca: RELIFE
Modelo: RL-044 HW4
Dimensiones del empaque:
Peso bruto:
xxx: xxx
Observaciones
"Precise hole position suitable for motherboard repair,good packaging, good for shipping."
---Caesar---
"Excellent service, precise hole position, good to repair motherboard."
---Bard---
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